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InGaAlP-High Brightness-Lumineszenzdiode (617nm, High Current and Flux) InGaAlP High Brightness LED (617nm, High Current and Flux) F 2000D
Vorlaufige Daten / Preliminary Data
Wesentliche Merkmale * Optimierte Lichtauskopplung durch Oberflachenstrukturierung und Stromverteilung * Chipgroe 700 x 700 m2 * Wellenlange (typ.) : 617 nm * Technologie:InGaAIP * Typ. Lichtflu: 20 lm @ 400 mA (gepulst, im Golden Dragon(R) Gehause). Anwendungen * Ampeln * Hinterleuchtung (LCD, Handy, Schalter, Tasten, Displays, Werbebeleuchtung, Allgemeinbeleuchtung) * Beleuchtung im Automobilbereich (z.B. Instrumentenbeleuchtung, Bremslichter und Blinklichter) * Ersatz von Kleinst-Gluhlampen * Tragbare Beleuchtung * Fassadenbeleuchtung im Innen- und Auenbereich Typ Type F 2000D Bestellnummer Ordering Code Q65110A0981 Feature * Optimized light extraction due to surface structuring and current distribution * Chip size 700 x 700 m2 * Wavelength (typ.): 617 nm * Technology: InGaAIP * Typ. luminous flux: 20 lm @ 400 mA (pulsed, in Golden Dragon(R) package) Applications * Traffic lights * Backlighting (LCD, cellular phones, switches, keys, displays, illuminated advertising,general lighting) * Automotive lighting (e.g. dashboard backlighting, brake lights, turn signal lamps, etc.) * Substitution of micro incandescent lamps * Portable light source * Indoor and outdoor commercial and residential architectural lighting
Beschreibung Description Rot emittierender Chip mit optimierter Lichtauskopplung durch Oberflachenstrukturierung, Oberseite Anodenanschluss Red emitting chip with optimized light extraction due to surface structuring, top side anode connection
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F 2000D
Elektrische Werte (TA = 25 C) Electrical values1) (TA = 25 C) Bezeichnung Parameter Dominantwellenlange Dominant wavelength IF = 400 mA, tp = 1.8 ms Sperrspannung Reverse voltage IR = 1A Durchlaspannung Forward voltage IF = 400 mA, tp = 1.8 ms Lichtstrom Luminous Flux3) IF = 400 mA, tp = 1.8 ms
1)
Symbol Symbol min. dom 613
Wert Value2) typ. max. 623
Einheit Unit nm
VR
12
V
VF
2.6
V
V
8000
mlm
Measurement limits describe actual settings and do not include measurement uncertainties. Each wafer and fragment of a wafer is subject to final testing. The wafer or its pieces are individually attached on foils (rings). Sample chips are picked from each foil and placed on a special carrier for measurement purposes. Sample-test: Sampling density/samples per cm (grid): 1,6/cm. If a sample fails, the distance area to the next non-failure samples is manually removed by a vacuum tool. All el. values are referenced to the vendor's measurement system (correlation to customer product(s) is required) Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information. This is not a specified value Luminous flux is measured in integrating sphere
2)
3)
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F 2000D
Mechanische Werte Mechanical values Bezeichnung Parameter Chipkantenlange (x-Richtung) Length of chip edge (x-direction) Chipkantenlange (y-Richtung) Length of chip edge (y-direction) Durchmesser des Wafers Diameter of the wafer Chiphohe Die height Bondpaddurchmesser Diameter of bondpad Weitere Informationen Additional information2) Vorderseitenmetallisierung Metallization frontside Ruckseitenmetallisierung Metallization backside Trennverfahren Dicing Verbindung Chip - Trager Die bonding
1)
Symbol Symbol min. 0.68 0.68
Wert Value1) typ. 0.7 0.7 100 200 110 220 120 240 130 max. 0.72 0.72
Einheit Unit mm mm mm m m
Lx Ly D H
d
Aluminium Aluminum Goldlegierung Gold alloy Sagen Sawing Kleben Epoxy bonding
Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information. This is not a specified value All chips are checked according to the following procedure and the OSRAM OS specification of the visual inspection A63501-Q0013-N001-*-76G3: The visual inspection shall be made in accordance to the "specification of the visual inspection" as referenced.The visual inspection of chip backside is performed with stereo microscope with incident light with 40x-80x magnification. Areas > 1/4 cm which have an amount of more than 3% failed dies will be removed. The visual inspection of chip frontside is performed by a stereo microscope with incident light with 40x-80x magnification for 100% of the area of each wafer. Areas > 1 cm which have an amount of more than 50% failed dies and areas > 2 cm which have an amount of more than 25% failed dies will be removed. In areas with failure density higher than 1% each failure die is inked individually. On request the visual inspection of chip frontside can be performed by an automated visual inspection combined with automated inking additionally. The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure by QM after the final visual inspection is not installed.
2)
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F 2000D
fj
Grenzwerte1) Maximum Ratings Bezeichnung Parameter Maximaler Betriebstemperaturbereich Maximum Operating temperature range Maximaler Lagertemperaturbereich Maximum storage temperature range Maximaler Durchlastrom (TA = 25C) Maximum forward current (TA = 25C) Maximaler Pulsstrom (TA = 25C) Maximum surge Current (TA = 25C) tp = 10 s, D = 0.05 Maximale Sperrschichttemperatur Maximum junction temperature
1)
Symbol Symbol Top Tstg IF
Wert Value -40...+100 -40...+100 400 0.4
Einheit Unit C C mA A
Ipeak
Tj
125
C
Maximum ratings are strongly package dependent and may differ between different packages. The values given represent the chip in an OSRAM Opto Semiconductor's Golden Dragon(R) package.
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F 2000D
Durchlassstrom1) IF = f (VF) Forward Current TA = 25 C
10 3 mA
OHL00787
Relative Lichtstarke1) IV/IV(400mA) = f (IF) Relative Luminous Intensity TA = 25 C
10 1
OHL00788
IF
IV I V (400 mA)
10 2
10 -1
10 -2
10
1
10 -3
10 0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
V 2.8
10 -4 10 -1
10 0
10 1
10 2 mA 10 3
VF
IF
Maximal zulassiger Durchlastrom1) IF = f (TS) Maximum Permissible Forward Current
450 mA IF 400 350
OHL01787
Relative Lichtstarke1) IV/IV(25C) = f (TS) Relative Luminous Intensity IF = 400 mA
1.6
OHL00987
IV IV (25 C)
1.2
300
1.0
250
0.8
200 150 100 50 0 0 20 40 60 80 C 100
0.6 0.4 0.2 0 -40 -20
0
20
40
60
C 100
TS
1) Based on typ.(see page 2, footnote 2 for explanation)
T
data measured in OSRAM Opto Semiconductor's Golden Dragon(R) package.
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F 2000D
Mazeichnung Chip Outlines
0.12 (0.0047)
0.7 (0.0276)
p-contact
0.22 (0.0087)
n-contact
GCOY6111
Mae werden als typische1) Werte wie folgt angegeben: mm (inch) / Dimensions are specified as typical1) values as follows: mm (inch). Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg (c) All Rights Reserved. Attention please! The information generally describes the type of component and shall not be considered as assured characteristics or detailed specification. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our sales organization. Handling and Storage Conditions: The hermetically sealed shipment lot shall be opened under temperature and moisture controlled cleanroom environment only. Customer has to follow the according rules for disposition of material that can be hazardous for humans and environment. Packing Chips are placed on a blue foil, which is fixed in a yellow frame of 5" diameter. For shipment the wafers of a shipment lot are arranged to stacks. The stacks are hermetically sealed in plastic bags to achieve protection against environmental influence (humidity & contamination). Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You will have to bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Further Conditions: If not otherwise arranged, the "General Conditions for the supply of products and services of the electrical and electronics industry" apply for any shipment, just as the Supplier Addendum " Chip business" to the "General Conditions for the supply of products and services of the electrical and electronics industry". If these documents are not familiar to you, please request them at our nearest sales office. Components used in life-support devices or systems must be expressly authorized by us for such purpose! Critical components2), may only be used in life-support devices or systems3) with the express written approval of OSRAM OS.
1)
Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information. This is not a specified value. 2) A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 3) Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.
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